Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17858154
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Filing Dt:
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07/06/2022
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Publication #:
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Pub Dt:
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01/12/2023
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Inventors:
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Young Min CHOI, Seung Hoon JIN
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Title:
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TEST PAD AND CHIP ON FILM PACKAGE INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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222, TECHNO 2-RO, YUSEONG-GU |
DAEJEON, KOREA, REPUBLIC OF 34027 |
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HARNESS, DICKEY & PIERCE, PLC |
7700 BONHOMME, SUITE 400 |
SAINT LOUIS, MO 63105 |
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09/22/2024 01:59 PM
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