Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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17810989
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Filing Dt:
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07/06/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Hee Joon Lee, Sun Jun Kwon, Seung Ryong Jeong, Tae Kyung Lee, Jin Young Yoon et al
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Title:
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THERMOPLASTIC RESIN COMPOSITION HAVING HIGH RIGIDITY AND LOW COEFFICIENT OF LINEAR THERMAL EXPANSION AND MOLDED ARTICLE COMPRISING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12, HEOLLEUNG-RO |
| SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 12, HEOLLEUNG-RO |
| SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 773 SUNSEONG-RO, SUNSEONGMYEON |
| CHUNGCHEONGNAM-DO |
| DANGJIN-SI, KOREA, REPUBLIC OF 91758 |
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| JORDAN J. PRINGLE |
| 300 SOUTH WACKER DRIVE |
| CHICAGO, IL 60606 |
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