Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/28/2024
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Application #:
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17858378
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Filing Dt:
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07/06/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Hee Joon Lee, Sun Jun Kwon, Seung Ryong Jeong, Eun Hwa Jang, Jin Young Yoon, Dong Eun Cha et al
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Title:
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THERMOPLASTIC RESIN COMPOSITION HAVING HIGH RIGIDITY AND LOW COEFFICIENT OF LINEAR THERMAL EXPANSION AND MOLDED ARTICLE COMPRISING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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12, HEOLLEUNG-RO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF 06797 |
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12, HEOLLEUNG-RO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF 06797 |
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51 BORAMAE-RO 5-GIL, DONGJAK-GU |
SEOUL, KOREA, REPUBLIC OF 07071 |
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MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
300 SOUTH WACKER DRIVE |
CHICAGO, IL 60606 |
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09/24/2024 10:43 PM
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