Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17785069
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Filing Dt:
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06/14/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Wanqing JIANG, Hiroshi HYODO, Hisashi SUDA, Akira SUGAWARA
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Title:
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Cu-Ni-Si-BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-14-1, SOTOKANDA, CHIYODA-KU, |
| TOKYO, JAPAN 101-0021 |
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| CLARK & BRODY LP |
| 1700 DIAGONAL ROAD |
| SUITE 310 |
| ALEXANDRIA, 22314 UNITED STATES |
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