Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17945231
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Filing Dt:
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09/15/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Cameron MCKNIGHT-MACNEIL, Abhinandan DIXIT, Ahmad MIZAN, An-Sheng CHENG
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Title:
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FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 201, 770 PALLADIUM DRIVE |
| KANATA, CANADA K2V1C8 |
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| MILTONS IP/P.I. |
| 200-15 FITZGERALD RD |
| NEPEAN, ONC K2H 9G1 |
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