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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17859301
Filing Dt:
07/07/2022
Publication #:
20230019730
Pub Dt:
01/19/2023
Inventors:
SEUNG CHUL HONG, DEOK SU HAN, JIN HYUK LIM, DONGHYUN KIM, JIEUN LEE
Title:
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND MANUFACTURING METHOD FOR POLISHED ARTICLE
Assignment: 1
Reel/Frame:
060430/0456Recorded: 07/07/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HONG, SEUNG CHUL
Exec Dt:
07/06/2022
HAN, DEOK SU
Exec Dt:
07/06/2022
LIM, JIN HYUK
Exec Dt:
07/05/2022
KIM, DONGHYUN
Exec Dt:
07/05/2022
LEE, JIEUN
Exec Dt:
07/05/2022
Assignees:
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO
PYEONGTAEK-SI, KOREA, REPUBLIC OF 17784
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUP, GYEONGGI-DO
ICHEON-SI, KOREA, REPUBLIC OF 17336
Correspondent:
NSIP LAW
P.O.BOX 65745
WASHINGTON, DC 20035
Assignment: 2
Reel/Frame:
065509/0991Recorded: 11/09/2023Pages: 9
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
SKC SOLMICS CO., LTD.
Exec Dt:
11/03/2023
Assignee:
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO
PYEONGTAEK-SI, KOREA, REPUBLIC OF 17784
Correspondent:
NSIP LAW
P.O. BOX 65745
WASHINGTON, DC 20035

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