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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/05/2024
Application #:
17933787
Filing Dt:
09/20/2022
Publication #:
Pub Dt:
01/19/2023
Inventors:
Wontae JEONG, Eungkyu PARK, Dongyeop LEE, Yonghwa KIM, Gihoon LEE, Jaehwan LEE et al
Title:
ELECTRONIC DEVICE WITH SEALING STRUCTURE
Assignment: 1
Reel/Frame:
061488/0918Recorded: 09/20/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/25/2019
Exec Dt:
06/24/2019
Exec Dt:
06/25/2019
Exec Dt:
06/25/2019
Exec Dt:
06/25/2019
Exec Dt:
06/25/2019
Exec Dt:
06/25/2019
Exec Dt:
07/01/2019
Exec Dt:
06/25/2019
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
DOCKET CLERK
P.O. DRAWER 800889
DALLAS, TX 75380

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