Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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17382521
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Filing Dt:
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07/22/2021
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Publication #:
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Pub Dt:
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01/26/2023
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Inventors:
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Feng Zhou, Hiroshi Ukegawa, Ercan Dede
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Title:
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SYSTEMS INCLUDING A POWER DEVICE-EMBEDDED PCB DIRECTLY JOINED WITH A COOLING ASSEMBLY AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6565 HEADQUARTERS DRIVE W1-3C |
| PLANO, TEXAS 75024 |
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| DINSMORE & SHOHL LLP |
| 255 E. FIFTH STREET, SUITE 1900 |
| CINCINNATI, OH 45202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, TOYOTA-CHO |
| TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
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| DINSMORE &SHOHL LLP |
| 6 PPG PLACE, SUITE 1300 |
| PITTSBURGH, PA 15222 |
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