Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17698611
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Filing Dt:
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03/18/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Inventors:
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Ming-Chih Yew, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh, Shin-Puu Jeng
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Title:
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Semiconductor Packages with Thermal Lid and Methods of Forming the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL LLP/TSMC |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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05/29/2024 06:26 PM
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