Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17785914
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Filing Dt:
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06/16/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Inventors:
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Yusheng SHI, Rongzhen LIU, Gong CHEN, Yu YANG, Jie LIU, Shifeng WEN, Jiamin WU
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Title:
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MULTI-FIELD COMPOSITE-BASED ADDITIVE MANUFACTURING DEVICE AND MULTI-FIELD COMPOSITE-BASED ADDITIVE MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.1037 LUOYU ROAD, HONGSHAN WUHAN, |
HUBEI, CHINA 430074 |
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JCIPRNET |
8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
TAIPEI, 100404 TAIWAN |
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