Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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06/11/2024
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Application #:
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17672285
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Filing Dt:
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02/15/2022
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Publication #:
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Pub Dt:
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02/02/2023
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Inventors:
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SHIH-YEN CHEN, CHIH-YUAN CHIU, CHI-CHUN PENG, HUI-TING LIN, HONG-KUN CHEN
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Title:
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BONDING TOOL AND BONDING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 1100 QUAIL STREET, SUITE 202 |
| NEWPORT BEACH, CA 92660 |
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05/29/2024 12:39 PM
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