Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2024
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Application #:
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17389779
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Filing Dt:
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07/30/2021
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Publication #:
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Pub Dt:
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02/02/2023
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Inventors:
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Zhong-Xiang He, Alvin J. Joseph, Jeonghyun Hwang, Richard J. Rassel, Ramsey M. Hazbun et al
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Title:
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INTEGRATED CIRCUIT STRUCTURE WITH THROUGH-METAL THROUGH-SUBSTRATE INTERCONNECT AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 400 STONEBREAK ROAD EXTENSION |
| MALTA, NEW YORK 12020 |
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| GIBB & RILEY, LLC |
| 550M RITCHIE HIGHWAY, #286 |
| SEVERNA PARK, MD 21146 |
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09/23/2024 11:07 PM
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