Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17790763
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Filing Dt:
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07/05/2022
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Publication #:
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Pub Dt:
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02/02/2023
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Inventors:
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Merve Anderson, Michael Eritt, Judith Geoerg, Michael Meissner, Ralph Wichtendahl
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Title:
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ENCAPSULATION SYSTEM FOR AN OPTOELECTRONIC COMPONENT COMPRISING AT LEAST A FIRST ENCAPSULATION AND A SECOND ENCAPSULATION, AND OPTOELECTRONIC COMPONENT COMPRISING AN ENCAPSULATION SYSTEM OF THIS KIND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TREIDLERSTRASSE 3 |
| DRESDEN, GERMANY 01139 |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 NORTH STETSON AVENUE |
| CHICAGO, IL 606016731 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TREIDLERSTRASSE 3 |
| DRESDEN, GERMANY 01139 |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 NORTH STETSON AVENUE |
| CHICAGO, IL 606016731 |
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