Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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17396291
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Filing Dt:
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08/06/2021
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Publication #:
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Pub Dt:
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02/09/2023
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Inventors:
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Lin Hou, Peter Rabkin, Yangyin Chen, Masaaki Higashitani
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Title:
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BONDED ASSEMBLY INCLUDING INTER-DIE VIA STRUCTURES AND METHODS FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5080 SPECTRUM DRIVE |
| SUITE 1050W |
| ADDISON, TEXAS 75001 |
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| THE MARBURY LAW GROUP, PLLC |
| 11800 SUNRISE VALLEY DRIVE |
| 15TH FLOOR |
| RESTON, 20191 UNITED STATES |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 951 SANDISK DRIVE |
| LEGAL DEP. |
| MILPITAS, CALIFORNIA 95035 |
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| SANDISK TECHNOLOGIES INC |
| 951 SANDISK DRIVE |
| LEGAL DEP. |
| MILPITAS, CA 95035 |
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Assignment:
3
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| 131 SOUTH DEARBORN ST. |
| FLOOR 04 |
| CHICAGO, ILLINOIS 60603 |
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| MICHAEL VIOLET |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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Assignment:
4
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PARTIAL RELEASE OF SECURITY INTERESTS
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| 951 SANDISK DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| MICHAEL VIOLET |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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08/06/2025 01:16 PM
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