Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17812786
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Filing Dt:
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07/15/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Inventors:
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Chin-Lai CHEN, Wen-Sung HSU, Duen-Yi HO, Ta-Jen YU, Tai-Yu CHEN, Hsiao-Yun CHEN et al
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Title:
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SEMICONDUCTOR PACKAGE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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| MCCLURE, QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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