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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/11/2024
Application #:
17969424
Filing Dt:
10/19/2022
Publication #:
Pub Dt:
02/16/2023
Inventor:
Gang Wang
Title:
METHODS FOR ETCHING A SEMICONDUCTOR STRUCTURE AND FOR CONDITIONING A PROCESSING REACTOR
Assignment: 1
Reel/Frame:
061473/0282Recorded: 10/19/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/20/2021
Assignee:
NO. 8 INDUSTRIAL EAST ROAD 2
HSINCHU, TAIWAN
Correspondent:
ARMSTRONG TEASDALE LLP
7700 FORSYTH BLVD., SUITE 1800
ST. LOUIS, MO 63105

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