Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17680681
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Filing Dt:
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02/25/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Inventors:
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Chien-Sheng Wu, Chia-Hao Chang, Chia-Yi Chiang, Chih-Hsien Hsu, Tai-Pin Chuang
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Title:
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ETCHING METHODS FOR INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8 LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| FAY SHARPE LLP |
| 1228 EUCLID AVE |
| CLEVELAND, OH 44115 |
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06/25/2024 09:53 AM
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