Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18045256
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Filing Dt:
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10/10/2022
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Publication #:
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Pub Dt:
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02/23/2023
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Inventors:
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Andreas ZLUC, Heinz MOITZI, Johannes STAHR, Mike MORIANZ
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Title:
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Component Carrier With Embedded Semiconductor Component and Embedded Highly-Conductive Block Which are Mutually Coupled
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FABRIKSGASSE 13 |
| LEOBEN, AUSTRIA 8700 |
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| SMITH TEMPEL BLAHA LLC - DOCKETING DEPARTMENT |
| 1600 PARKWOOD CIRCLE SE, SUITE 620 |
| ATLANTA, GA 30339 |
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