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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17723552
Filing Dt:
04/19/2022
Publication #:
Pub Dt:
02/23/2023
Inventors:
Sechul PARK, Unbyoung KANG, Heewon KIM, Jongho PARK, Hyojin YUN, Juil CHOI
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
059631/0335Recorded: 04/19/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/08/2022
Exec Dt:
02/08/2022
Exec Dt:
02/08/2022
Exec Dt:
02/08/2022
Exec Dt:
02/08/2022
Exec Dt:
02/08/2022
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
EUGENE M LEE
LEE IP LAW, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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