Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17463124
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Filing Dt:
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08/31/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Chung-Hao LIN, Hung-Yu CHOU, Dong-Ren PENG, Yuh-Harng CHIEN, Bo-Hsun PAN, Pi-Chiang HUANG
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Title:
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SEMICONDUCTOR DIE MOUNTED IN A RECESS OF DIE PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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12500 TI BOULEVARD |
M/S 3999 |
DALLAS, TEXAS 75243 |
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TEXAS INSTRUMENTS INCORPORATED |
PO BOX 655474 |
M/S 3999 |
DALLAS, TX 75265 |
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09/23/2024 07:00 AM
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