Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17820199
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Filing Dt:
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08/16/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Wei Zhou, Eiichi Nakano, Ying Ta Chiu
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Title:
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POLYMER COATED SEMICONDUCTOR DEVICES AND HYBRID BONDING TO FORM SEMICONDUCTOR ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707-0006 |
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| PERKINS COIE LLP - MICRON PATENT-SEA |
| 1201 THIRD AVENUE SUITE 4900 |
| SEATTLE, WA 98101 |
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