Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/19/2024
|
Application #:
|
17446515
|
Filing Dt:
|
08/31/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2023
| | | | |
|
Inventors:
|
Te-Hsin CHIU, Shih-Wei PENG, Wei-Cheng LIN, Jiann-Tyng TZENG, Jiun-Wei LU
|
|
Title:
|
INTEGRATED CIRCUIT WITH FRONTSIDE AND BACKSIDE CONDUCTIVE LAYERS AND EXPOSED BACKSIDE SUBSTRATE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
|
|
|
|
| MERCHANT & GOULD PC |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
|
|
Search Results as of:
05/30/2024 09:53 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
