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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/19/2023
Application #:
17460798
Filing Dt:
08/30/2021
Publication #:
Pub Dt:
03/02/2023
Inventors:
Hsiao-Kang CHANG, Kai-Fang CHENG, Ting-Ya LO
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING LOW-K CARBON-CONTAINING DIELECTRIC LAYER
Assignment: 1
Reel/Frame:
057671/0738Recorded: 10/01/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/13/2021
Exec Dt:
09/13/2021
Exec Dt:
09/13/2021
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP.
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22040-0747
Assignment: 2
Reel/Frame:
060467/0754Recorded: 07/10/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/12/2022
Exec Dt:
06/12/2022
Exec Dt:
06/21/2022
Exec Dt:
06/22/2022
Exec Dt:
06/30/2022
Assignee:
NO. 8, LI-HSIN 6 ROAD
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
FOLEY & LARDNER LLP
500 WOODWARD AVENUE
SUITE 2700
DETROIT, MI 48226

Search Results as of: 11/12/2024 01:48 PM
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