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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17462009
Filing Dt:
08/31/2021
Publication #:
20230066363
Pub Dt:
03/02/2023
Inventors:
Che-Hsiang Hsu, Chung-Shi Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu, Chung-Ming Weng et al
Title:
PACKAGE HAVING PRISM STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
057496/0219Recorded: 09/16/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HSU, CHE-HSIANG
Exec Dt:
08/17/2021
YU, CHEN-HUA
Exec Dt:
08/17/2021
LIU, CHUNG-SHI
Exec Dt:
08/17/2021
TSAI, HAO-YI
Exec Dt:
08/20/2021
HSIEH, CHENG-CHIEH
Exec Dt:
08/17/2021
KUO, HUNG-YI
Exec Dt:
08/17/2021
YU, TSUNG-YUAN
Exec Dt:
08/17/2021
LIN, HUA-KUEI
Exec Dt:
08/17/2021
WENG, CHUNG-MING
Exec Dt:
08/17/2021
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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