Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2023
|
Application #:
|
17412596
|
Filing Dt:
|
08/26/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2023
| | | | |
|
Inventors:
|
Ching-Hung Wang, Ching I Li, Yeong-Jyh Lin, Tzu-Wei Yu, Chung-Yi Yu
|
|
Title:
|
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| ESCHWEILER & POTASHNIK, LLC |
| 629 EUCLID AVE. |
| SUITE 1101 |
| CLEVELAND, OH 44114 |
|
|
Search Results as of:
05/28/2024 03:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
