Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17893154
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Filing Dt:
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08/22/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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DONG CHEN, DOU JIN, HONG XU, XIA XU, JINHUI CHEN
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Title:
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CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 78 CHANGSHAN ROAD, JIANGYIN |
| WUXI CITY, JIANGSU PROVINCE, CHINA 214430 |
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| CHENG-JU CHIANG |
| P.O. BOX 766 |
| CHINO, CA 91708 |
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