Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/14/2023
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Application #:
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17463994
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Filing Dt:
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09/01/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Fatma Arzum Simsek-Ege, Marsela Pontoh, Luoqi Li
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Title:
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SEMICONDUCTOR DIE ASSEMBLIES WITH DECOMPOSABLE MATERIALS AND ASSOCIATED METHODS AND SYSTEMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 S. FEDERAL WAY |
P.O. BOX 6 |
BOISE, IDAHO 83707-0006 |
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PERKINS COIE LLP - MICRON PATENT-SEA |
PO BOX 1247 |
SEATTLE, WA 98111-1247 |
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09/24/2024 11:35 AM
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