Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17466732
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Filing Dt:
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09/03/2021
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Publication #:
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Pub Dt:
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03/09/2023
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Inventors:
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Ge Qu, Zhiyuan Wu, Feng Chen, Carmen Leal Cervantes, Yong Jin Kim, Kevin Kashefi et al
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Title:
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Method Of Forming A Metal Liner For Interconnect Structures
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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SERVILLA WHITNEY LLC |
33 WOOD AVENUE SOUTH |
SUITE 830 |
ISELIN, NJ 08830 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE 6TH ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 057533 FRAME: 0813. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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SERVILLA WHITNEY LLC |
33 WOOD AVE SOUTH, SUITE 830 |
ISELIN, NJ 08830 |
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05/31/2024 08:55 AM
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