Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17989498
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Filing Dt:
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11/17/2022
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Publication #:
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Pub Dt:
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03/09/2023
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Inventors:
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Yen-Yao Chi, Ta-Jen Yu, Shih-Chin Lin, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu
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Title:
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CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, DUSING 1ST RD. |
HSINCHU SCIENCE PARK |
HSINCHU CITY 30078, TAIWAN R.O.C. |
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WOLF, GREENFIELD & SACKS, P.C. |
600 ATLANTIC AVENUE |
BOSTON, MA 02210-2206 |
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