Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17471061
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Filing Dt:
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09/09/2021
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Publication #:
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Pub Dt:
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03/09/2023
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Inventors:
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Chin-Kwan KIM, Kuiwon KANG, Joan Rey Villarba BUOT
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Title:
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PACKAGE COMPRISING A SUBSTRATE WITH HIGH-DENSITY INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| LOZA & LOZA LLP |
| 305 NORTH SECOND AVE., #127 |
| UPLAND, CA 91786-6064 |
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