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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17841838
Filing Dt:
06/16/2022
Publication #:
Pub Dt:
03/09/2023
Inventors:
Jie Xue, D. Brice Achkir, Mark Charles Nowell
Title:
ARCHITECTURE AND PACKAGING FOR INTEGRATED CIRCUITS
Assignment: 1
Reel/Frame:
060224/0847Recorded: 06/16/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/04/2022
Exec Dt:
06/03/2022
Exec Dt:
06/02/2022
Assignee:
170 WEST TASMAN DRIVE
SAN JOSE, CALIFORNIA 95134-1706
Correspondent:
D. ANDREW FLOAM
9801 WASHINGTONIAN BLVD.
SUITE 750
GAITHERSBURG, MD 20878

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