Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17482718
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Filing Dt:
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09/23/2021
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Publication #:
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Pub Dt:
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03/23/2023
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Inventors:
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Hong Bok We, Aniket Patil, Joan Rey Villarba Buot
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Title:
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INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ADDED METAL FOR EMBEDDED METAL TRACES IN ETS-BASED SUBSTRATE FOR REDUCED SIGNAL PATH IMPEDANCE, AND RELATED FABRICATION METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| W&T/QUALCOMM |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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06/19/2024 07:36 AM
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