Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17508176
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Filing Dt:
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10/22/2021
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Publication #:
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Pub Dt:
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03/23/2023
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Inventors:
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Yaqi MA, Zhang-Ying YAN, Lei PAN, Jing DING
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Title:
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INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| 4000, WEN XIANG RD. |
| SONGJIANG |
| SHANGHAI, CHINA |
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| 16, ZIFENG RD., PUKOU ECONOMIC DEVELOPMENT ZONE |
| NANJING |
| JIANGSU, CHINA |
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| HAUPTMAN HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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05/29/2024 06:48 PM
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