Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17500976
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Filing Dt:
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10/14/2021
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Publication #:
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Pub Dt:
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03/23/2023
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Inventors:
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Chun Yi Kuo, JIA HAO LIANG, Ching Ku Lin
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Title:
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METHOD OF IMPROVING WIRE STRUCTURE OF CIRCUIT BOARD AND IMPROVING WIRE STRUCTURE OF CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.179, SHANYING ROAD, GUISHAN DISTRICT |
| TAOYUAN CITY, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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