Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18061676
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Filing Dt:
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12/05/2022
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Publication #:
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Pub Dt:
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03/30/2023
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Inventors:
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Shuen-Shin LIANG, Chun-Hsien HUANG, Hung-Yi HUANG, Chun-I TSAI, Chih-Wei CHANG et al
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Title:
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CAPPING LAYER FOR LINER-FREE CONDUCTIVE STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| EDITH THOMPSON |
| 1101 K STREET, 10TH FLOOR |
| WASHINGTON, DC 20005 |
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06/04/2024 03:21 AM
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