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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17945891
Filing Dt:
09/15/2022
Publication #:
Pub Dt:
03/30/2023
Inventors:
Hiroto IGAWA, Masanori NAKAYAMA, Katsunori FUNAKI, Tatsushi UEDA, Yasutoshi TSUBOTA et al
Title:
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
Assignment: 1
Reel/Frame:
061125/0174Recorded: 09/16/2022Pages: 13
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/02/2022
Exec Dt:
09/04/2022
Exec Dt:
09/12/2022
Exec Dt:
08/29/2022
Exec Dt:
08/29/2022
Exec Dt:
08/30/2022
Exec Dt:
08/29/2022
Exec Dt:
09/12/2022
Exec Dt:
08/30/2022
Assignee:
3-4, KANDAKAJI-CHO, CHIYODA-KU
TOKYO, JAPAN 101-0045
Correspondent:
VOLPE KOENIG
30 SOUTH 17TH STREET, 18TH FLOOR
PHILADELPHIA, PA 19103

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