Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/09/2024
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Application #:
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17959502
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Filing Dt:
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10/04/2022
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Publication #:
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Pub Dt:
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04/13/2023
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Inventors:
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Young Woo LEE, Seul Gi LEE, Hui Joong KIM, Jae Yool SON, Jae Hun SONG, Jeong Tak MOON
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Title:
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LEAD-FREE SOLDER ALLOY AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 405, GEUMEO-RO, POGOK-EUP, CHEOIN-GU, YONGIN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 17030 |
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| CROWELL & MORING, LLP/JANAE GALLUN |
| 1001 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20004 |
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