Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17909146
|
Filing Dt:
|
09/02/2022
|
|
Publication #:
|
|
Pub Dt:
|
04/13/2023
| | | | |
|
Inventors:
|
Ling Xie, Menglong Tu, Mantie Li, Liang Yu
|
|
Title:
|
DIE BONDING METHOD FOR MICRO-LED
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| BLDG 8, BLOCK 2, BAIMANG BAIWANGXIN INDUSTRIAL PRK |
| XILI AREA, NANSHAN DISTRICT SHENZHEN |
| GUANGDONG, CHINA 518108 |
|
|
|
|
| DENTONS COHEN & GRIGSBY P.C. |
| 625 LIBERTY AVENUE |
| PITTSBURGH, PA 15222 |
|
|
Search Results as of:
06/06/2024 08:09 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
