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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/02/2024
Application #:
17529293
Filing Dt:
11/18/2021
Publication #:
Pub Dt:
04/20/2023
Inventors:
Yu-Ju Chang, Jia-Liang Chen, Chun-Hong Chen
Title:
INTERPOSER AND SEMICONDUCTOR PACKAGE EACH HAVING CONDUCTIVE TERMINALS ON REDISTRIBUTION LAYER WITH DIFFERENT PITCH
Assignment: 1
Reel/Frame:
058210/0045Recorded: 11/24/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/15/2021
Exec Dt:
11/12/2021
Exec Dt:
11/12/2021
Assignees:
NO.10, LIXING 6TH RD., SCIENCE-BASED INDUSTRIAL PARK,
HSINCHU, TAIWAN 30078
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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