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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
07/02/2024
Application #:
18066777
Filing Dt:
12/15/2022
Publication #:
Pub Dt:
04/20/2023
Inventors:
Shih-Yao Lin, Li-Jung Kuo, Ming-Ching Chang, Hsiao Wen Lee, Chen-Ping Chen
Title:
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Assignment: 1
Reel/Frame:
062109/0607Recorded: 12/15/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/18/2021
Exec Dt:
05/09/2021
Exec Dt:
03/18/2021
Exec Dt:
03/18/2021
Exec Dt:
03/18/2021
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
FOLEY & LARDNER LLP
500 WOODWARD AVENUE
SUITE 2700
DETROIT, MI 48226

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