Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17581611
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Filing Dt:
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01/21/2022
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Publication #:
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Pub Dt:
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05/04/2023
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Inventors:
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Yen-Chun Huang, Fang-Yi Liao, Shu Ling Liao, Yu-Chang Lin
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Title:
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Hybrid Fin Structure of Semiconductor Device and Method of Forming Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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