Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18089207
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Filing Dt:
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12/27/2022
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Publication #:
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Pub Dt:
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05/04/2023
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Inventors:
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Loke Yip FOO, Choong Kooi CHEE
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Title:
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FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS WITH REDISTRIBUTION LAYER PACKAGING AND METHODS OF ASSEMBLING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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101 INNOVATION DRIVE |
SAN JOSE, CALIFORNIA 95134 |
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ANGELA MILLER |
C/O CLARIVATE |
P.O. BOX 5427 |
TUCSON, AZ 85703 |
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09/26/2024 03:03 PM
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