Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17452905
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Filing Dt:
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10/29/2021
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Publication #:
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Pub Dt:
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05/04/2023
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Inventors:
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Akhilesh Kumar Singh, Chee Seng Foong, Franciscus Henrikus Martinus Swartjes et al
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Title:
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STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT IN A SAME HORIZONTAL PLANE AS A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS NL-5656 AG |
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| INTELLECTUAL PROPERTY AND LICENSING NXP |
| 350 HOLGER WAY |
| SAN JOSE, CA 95134 |
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