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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/17/2024
Application #:
18149129
Filing Dt:
01/02/2023
Publication #:
Pub Dt:
05/11/2023
Inventors:
Po-Yu LIN, Chi-Yu Chou, Hsien-Ming Lee, Chi-Jen Yang, Huai-Tei Yang, Yi-Ting Wang et al
Title:
FORMATION AND IN-SITU ETCHING PROCESSES FOR METAL LAYERS
Assignment: 1
Reel/Frame:
068507/0984Recorded: 09/06/2024Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/10/2018
Exec Dt:
09/10/2018
Exec Dt:
09/10/2018
Exec Dt:
09/20/2018
Exec Dt:
09/10/2018
Exec Dt:
09/10/2018
Exec Dt:
09/10/2018
Exec Dt:
09/17/2018
Exec Dt:
09/17/2018
Assignee:
NO. 8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
CHRISTIAN A. CAMARCE
1101 K STREET, NW
10TH FLOOR
WASHINGTON, DC 20005

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