Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17521760
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Filing Dt:
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11/08/2021
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Publication #:
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Pub Dt:
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05/11/2023
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Inventors:
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Jeffrey S. Leib, Chia-Hong Jan, Seungdo An, Daniel B. OBrien, James Y. Jeong, Peng Bai et al
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Title:
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INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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ESSENTIAL PATENTS GROUP, LLP |
5 CENTERPOINTE DR. |
LAKE OSWEGO, OR 97035 |
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09/23/2024 08:51 PM
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