Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17984032
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Filing Dt:
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11/09/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Inventors:
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Byeong Yong LEE, Kum Sun PARK, Eun Ha PARK, Weon Bin JANG, Gun Won SEO, Chung Hyeon KIM
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Title:
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METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME FINE VIA AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 189, GUNSU 1-GIL, JIKSAN-EUP |
| SEOBUK-GU, CHEONAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31032 |
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| CROWELL & MORING LLP |
| P.O. BOX 10395 |
| CHICAGO, IL 60610 |
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