Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17910180
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Filing Dt:
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09/08/2022
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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Barbaros OEZYILMAZ, Chee Tat TOH, Irfan Haider ABIDI
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Title:
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A SEED LAYER, A HETEROSTRUCTURE COMPRISING THE SEED LAYER AND A METHOD OF FORMING A LAYER OF MATERIAL USING THE SEED LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21 LOWER KENT RIDGE ROAD |
| SINGAPORE, SINGAPORE 119077 |
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| BOTOS CHURCHILL IP LAW LLP |
| 430 MOUNTAIN AVENUE, SUITE 401 |
| NEW PROVIDENCE, NJ 07974 |
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