Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/25/2023
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Application #:
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17372265
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Filing Dt:
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07/09/2021
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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Xi-Wei LIN, Victor Moroz
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Title:
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FABRICATION TECHNIQUE FOR FORMING ULTRA-HIGH DENSITY INTEGRATED CIRCUIT COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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690 E. MIDDLEFIELD RD. |
MOUNTAIN VIEW, CALIFORNIA 94043 |
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HAYNES BEFFEL & WOLFELD LLP |
637 MAIN ST. |
PO BOX 366 |
HALF MOON BAY, CA 94019 |
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