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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/25/2023
Application #:
17372265
Filing Dt:
07/09/2021
Publication #:
Pub Dt:
05/18/2023
Inventors:
Xi-Wei LIN, Victor Moroz
Title:
FABRICATION TECHNIQUE FOR FORMING ULTRA-HIGH DENSITY INTEGRATED CIRCUIT COMPONENTS
Assignment: 1
Reel/Frame:
056812/0001Recorded: 07/09/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/08/2021
Exec Dt:
07/08/2021
Assignee:
690 E. MIDDLEFIELD RD.
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
HAYNES BEFFEL & WOLFELD LLP
637 MAIN ST.
PO BOX 366
HALF MOON BAY, CA 94019

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