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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18156752
Filing Dt:
01/19/2023
Publication #:
Pub Dt:
05/18/2023
Inventors:
Wei-An LAI, Wei-Cheng LIN, Kam-Tou SIO, Te-Hsin CHIU, Meng-Hung SHEN, Jiann-Tyng TZENG
Title:
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
062425/0297Recorded: 01/19/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/25/2020
Exec Dt:
11/25/2020
Exec Dt:
11/25/2020
Exec Dt:
11/25/2020
Exec Dt:
11/25/2020
Exec Dt:
11/25/2020
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAUPTMAN HAM, LLP
2318 MILL ROAD, SUITE 1400
ALEXANDRIA, VA 22314

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