Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17957138
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Filing Dt:
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09/30/2022
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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Xianming CHEN, Jindong FENG, Benxia HUANG, Yejie HONG
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Title:
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TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI, |
| GUANGDONG, CHINA 519175 |
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| THE PL LAW GROUP, PLLC |
| 13800 COPPERMINE ROAD |
| FL 1-3 |
| HERNDON,, VA 20171 |
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